09 Jan 2007
OS Trio Berhad recently confirmed the project with a Japanese company involving in the manufacturing of Heat Sinks for CPU, Mold Power Transistor, Printed Circuit (PC) Board, Extrusion Type Universal Coolers and other electronic equipments. The company decided to roll out the Financial, Distribution and Manufacturing Module for its production facility in Rawang.
OS TRIO ERM 2 web enabled features allowed the parent company in Japan to monitor the performance of the various business and operation processes. The entire implementation has been scheduled to complete in 5 months.
